PCB Prototype the Easy Way

Full feature custom PCB prototype service.

Exemple de circuits imprimés fabriqués par nous.

Nous avons les capacités de fabrication de PCB pour construire des planches simples à complexes. Veuillez passer en revue les circuits imprimés ci-dessous et nous faire savoir si vous avez des questions ou si vous souhaitez obtenir un devis officiel.

原图
Passez la souris dessus pour zoomer

2nd-order HDI buried/blind via board

Applications
Digital products and automotive electronics
Features
/
Material
TU-883
Layers
22 Layers
Thickness
1.6±0.16mm
Min Hole Size
Laser hole 0.1mm; mechanical hole 0.275mm
Min Track/Spacingh
100/100um
Minimum board thickness and hole ratio
12:1
Surface Finish
Immersion gold(ENIG) 0.05um
Calculer
Détails du produit

The 2nd-order HDI buried/blind hole board is made of Taiyao TU-883 material through surface immersion gold and laser or mechanical drilling. The minimum hole diameter can reach 0.1mm, and the Min Track/Spacing can reach 100um. This type of HDI board is widely used in digital products and automotive electronics.

hdi-2-1.jpg

Related Products Afficher plus >>
  • 7th-order arbitrary interconnection HDI buried/blind via circuit board

    The 7th-order HDI board is widely used in high-end smart phones and other fields

  • Mobile phone 3rd-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Automotive communication 2nd-order HDI board

    14 layers, Thickness: 1.6±0.16, Surface Finish: OSP

  • Industrial control 5th-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.8±0.18m

  • Semiconductor test 4th-order HDI board

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • Ipad 3rd-order HDI board

    8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • 10-layer 2nd-order HDI board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • 6th-order arbitrary interconnection HDI buried/blind via circuit board

    14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm

  • 4th-order HDI buried/blind via board

    10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

  • 3rd-order HDI board

    8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm

  • 3rd-order HDI PCB buried resistor circuit board

    8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm

  • 3rd-order 5G IoT HDI PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm