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What are Aluminum PCBs?

Aluminum PCBs (Printed Circuit Boards) are PCBs that have a metal core, usually made of aluminum, instead of the traditional FR4 (Fiberglass Reinforced Epoxy) material. The metal core provides better thermal conductivity, allowing for more efficient heat dissipation. This makes Aluminum PCBs ideal for high-power applications such as LED lighting, power electronics, and automotive applications.

Advantages of Aluminum PCBs

Environmentally Friendly

Aluminum is a highly recyclable material, and it’s non-toxic. Hence, using the metal for production promotes energy conservation thanks to its ease of assembly. So, when PCB suppliers use aluminum, it preserves environmental health.

Efficient Heat Dissipation

Aluminum Core PCBs have an aluminum core which provides excellent thermal conductivity. This allows for efficient heat dissipation, making them ideal for high-power LED lighting, automotive lighting, and power electronics.

High Durability

Aluminum is a durable material, making Aluminum Core PCBs highly resistant to wear and tear. They can withstand harsh environments, making them suitable for applications that require high reliability and durability.

Lightweight

Compared to traditional FR4 PCBs, Aluminum Core PCBs are lighter in weight. This makes them ideal for applications where weight is a concern, such as in aerospace and automotive industries.

Cost-effective

Despite their advanced properties, Aluminum Core PCBs are cost-effective and can be produced at a lower cost than other advanced PCB materials.

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Specification of Aluminum Based Copper -Clad Laminate

PCBWay adheres to the highest quality standards in material selection

Part Number	AL-01-B10	AL-01-B15	AL-01-B30	CS-AL-88-AD2	GL12, GL22
Vendor	BOYU	BOYU	BOYU	CSEM	GDM
Thermal Conductivity (W/m·k)	1.0	1.5	3.0	2.0	1.0 < λ≤1.5
Peel Strength (Lb/in)	≥8	≥8	≥8	>9	≥6
Breakdown Voltage (AC/KV)	5.0	5.0	4.0 for 75um dielectric thickness 4.5 for 100um dielectric thickness 6.0 for 125um dielectric thickness	>3	≥2
Tg (°C)	110	110	150	100	AABUS
Td (°C)	380	380	380	410	AABUS
Dk (@1MHz)	4.8	4.8	4.8	5.6	AABUS
Df (@1MHz)	≤0.02	≤0.02	≤0.02	0.013	AABUS
MOT	130°C	130°C	130°C	130°C	-

Types of Aluminum PCBs

Hybrid Aluminum PCBs

Multilayer Aluminum PCBs

Through-hole Aluminum PCBs

Characteristics

1-In a hybrid aluminum structure, non-thermal materials are separately processed and refined before being applied to thermal materials with an aluminum base.
2-The most common approach is to develop 2-layer or 4-layer structures typically composed of FR4 material.
3-The non-thermal material, bonded to the thermal material and aluminum base, provides rigidity and aids in heat dissipation.
4-This non-thermal bonding is preferred over using all thermal materials as it offers lower costs and higher thermal efficiency compared to conventional FR4 products.
5-The development of this product does not require heat sinks or related assembly steps.
6-Component windows are used in aluminum to accommodate through-hole components, allowing connectors and cables to pass through the board while soldering rounded corners to create a seal, eliminating the need for special washers or other expensive adapters.

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Characteristics

1-In the high-performance power supply market, multilayer aluminum PCBs are very common and made with multilayer thermal dielectrics.
2-These structures feature one or multiple layers of circuits embedded in the dielectric, with blind vias serving as thermal vias or signal paths.
3-Single-layer designs are not very efficient, but when they come with more complex designs, they provide an ideal solution for many heat-related applications.

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Characteristics

1-When dealing with the most complex structures, single-layer aluminum is backfilled and pre-drilled before being laminated to form the core of a multilayer structure.
2-The thermal material layers are then laminated on both sides of the aluminum using thermal bonding materials.
3-Once lamination is complete, drilling is applied for assembly.
4-To maintain proper electrical insulation, the electroplated through-holes resulting from drilling must pass through the aluminum gap.

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Ability in Process Technology

Feature	Capability
Material	Aluminum core (Domestic 1060), Copper core, FR4 covering
Thermal Conductivity	1.0W/(m⋅K) 1.5W/(m⋅K) 2.0W/(m⋅K) 3.0W/(m⋅K)
Min. Track/Spacing	4mil
Min. Hole Size	1layer（0.8mm) 2layers (0.2mm)
Board Thickness	0.4-3.2mm
Surface Finishing	Immersion gold, OSP, Hard gold, Immersion silver, ENEPIG
Finsih copper	1-4oz

Feature	Capability
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte black, Matte green
Silkscreen	White, Black
Via Process	Tenting Vias, Plugged Vias, Vias not covered
Testing	Fly Probe Testing (Free) and A.O.I. testing
Build Time	2-3 days
Lead Time	3-4 days

Substrate Materia:	Aluminum Base
Board Thickness/Copper Thickness:	2.0mm/70um
Thermal Conductivity:	1.0 - 5.0W/m.k
Surface Treatment:	HAL/OSP/HASL(LF)
Breakdown Voltage:	1.5-3.0KV(DC)

Substrate Material:	Aluminum Base
Board Thickness/Copper Thickness:	2.0mm/70um
Thermal Conductivity:	1.0 - 3.0W/m.k
Surface Treatment:	HAL/OSP/HASL(LF)
Breakdown Voltage:	1.0-3.0KV(DC)

Substrate Material:	Aluminum Base
Board Thickness/Copper Thickness:	2.0mm/70um
Thermal Conductivity:	1.0 - 5.0W/m.k
Surface Treatment:	HAL/OSP/HASL(LF)
Breakdown Voltage:	1.5-3.0KV(DC)

Substrate Material:	Aluminum Base
Board Thickness/Copper Thickness:	2.0mm/70um
Thermal Conductivity:	1.0 - 5.0W/m.k
Surface Treatment:	HAL/OSP/HASL(LF)
Breakdown Voltage:	1.5-3.0KV(DC)

Substrate Material:	Aluminum Base
Board Thickness/Copper Thickness:	2.0mm/70um
Thermal Conductivity:	1.0 - 3.0W/m.k
Surface Treatment:	HAL/OSP/HASL(LF)
Breakdown Voltage:	1.0-3.0KV(DC)

Substrate Material:	Aluminum Base
Board Thickness/Copper Thickness:	0.6mm/70um
Thermal Conductivity:	1.0 - 3.0W/m.k
Surface Treatment:	OSP/HAL/HASL(LF)
Breakdown Voltage:	1.0-3.0KV(DC)

Substrate Material:	FR-4
Process Characteristics:	High Density P1.25 - P2.5
Number of Layers:	2-8 Layers
Board Thickness/Copper Thickness:	1.2-2.0mm/35um
Surface Treatment:	OSP / ENIG, etc

Substrate Material:	FR-4
Process Characteristics:	High Density
Number of Layers:	2-8 Layers
Board Thickness/Copper Thickness:	1.2-2.0mm/35um
Surface Treatment:	OSP / ENIG, etc.

Manufacturing Production Capacity

Upgrading of copper deposition line

Improve the process capability of PTH sunk copper (especially blind holes) to provide customers with high reliability products.

VCP copper plating line

Enhance copper plating capacity, improve copper plating uniformity, and have HDI hole filling capability.

4-wire flying probe tester

Better discriminate the product micro open circuit, micro short circuit, provide high precision resistance test requirements, make the product more reliable.

LDI laser direct imaging exposure machine

Achieves higher resolution while balancing the need for high alignment accuracy and high throughput.

Vacuum press

Enhance the effect of laminating rigid-flex PCBs and multilayer PCBs.

Laser equipment

Improve sample response speed as well as cover film,contour processing accuracy, with HDI laser drilling capability.

PCBWay's Advantages

PCBWay offers a wide range of PCB services, including flex, rigid-flex, and rigid PCB fabrication, ensuring that we can cater to diverse project requirements. We use top-grade materials and state-of-the-art equipment to guarantee optimal performance and reliability of their PCBs. PCBWay's commitment to quality, affordability, and customer satisfaction makes us a top choice for businesses and individuals seeking high-quality, customized, and reliable PCB fabrication services.

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Testing and Inspection Equipment

Salt spray tester

X-ray surface treatment thickness gauge

Metallographic section microscope

AOI inspection machine

Ion contamination tester

2D dimensional measuring instrument

Impedance tester

RoHS/HF tester

Applications of Aluminum PCBs

Audio device

Power supply

Communication electronic equipment

Office automation equipment

Automobile

Computer

Power modules

Lamps and lighting

FAQ's

What are the advantages of using Aluminum PCBs over traditional FR4 PCBs?

Aluminum PCBs offer superior thermal performance and durability compared to traditional FR4 PCBs, making them ideal for high-power and high-reliability applications.

How do I choose the right thickness of aluminum substrate for my PCB?

The appropriate thickness of the aluminum substrate for a PCB design depends on several factors, including the required thermal performance, mechanical strength, and cost considerations.

What surface finishes are compatible with Aluminum PCBs?

Popular surface finishes for aluminum PCBs include OSP, ENIG, and HASL. However, due to the unique properties of aluminum, some surface finishes may not be suitable, and it is important to consult with your PCB manufacturer for guidance.

How do I ensure good thermal management when designing with Aluminum PCBs?

To ensure good thermal management when designing with aluminum PCBs, it is important to consider the placement and size of thermal vias, the use of thermal pads for components, and the selection of appropriate heat sinks and cooling

solutions. It is also important to perform extensive testing and analysis to validate the thermal performance of the design.

Aluminum PCB Manufacturing

What are Aluminum PCBs?

Advantages of Aluminum PCBs

Environmentally Friendly

Efficient Heat Dissipation

High Durability

Lightweight

Cost-effective

Specification of Aluminum Based Copper -Clad Laminate

Types of Aluminum PCBs

Characteristics

Characteristics

Characteristics

Ability in Process Technology

Featured Product Solutions

Automotive Lamp Board

Lamp Board

Power Supply Board

Hybrid Mixed Pressure Aluminum Base Board

Double-Sided Sandwich Aluminum Base Board

Panel Lightm

LED High-Precision Lamp Board (P1.25)

Transparent Screen Lamp Board

Manufacturing Production Capacity

PCBWay's Advantages

Testing and Inspection Equipment

Order Online for PCB and PCB Assembly

Applications of Aluminum PCBs

Audio device

Power supply

Communication electronic equipment

Office automation equipment

Automobile

Computer

Power modules

Lamps and lighting

FAQ's

What are the advantages of using Aluminum PCBs over traditional FR4 PCBs?

How do I choose the right thickness of aluminum substrate for my PCB?

What surface finishes are compatible with Aluminum PCBs?

How do I ensure good thermal management when designing with Aluminum PCBs?

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