3rd-order HDI board

Produits de PCB / HDI PCB / 3rd-order HDI board

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Applications

Features

Material

A1000-2M

Layers

8 Layers

Thickness

2.5±0.25mm

Min Hole Size

Laser blind hole 0.1mm；mechanical hole 0.25mm

Min Track/Spacingh

127/127um

Minimum board thickness and hole ratio

10:1

Surface Finish

Immersion gold(ENIG) 0.05um

Calculer

Détails du produit

The third-order HDI circuit board is made of Shengyi A1000-2M material, and the surface is produced by immersion gold technology. The products are widely used in financial products such as POS machines.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

Silicon Carbide Gate Driver Board

PCB was greatly built, and they were delivered on time.

Engineer

MegaWang 2000 Turbo Edition - Super Scaled Sprites

This board worked first time and performs exactly as the design predicted. The assembly was very neat and painless. I'm happy with the sourced components and the speed of delivery. Here is a video to which shows the working board in the rest of the board stack. https://youtu.be/2BH-KohmC6U The soldering is very neat and the board is clean. I'm very happy the board can be produced with a PNP machine and automated assembly.

Piper

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