PCB Prototype the Easy Way

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La Structure multicouche stratifiée PCB

Devis instantané & Commander En Ligne

4+6+4 HDI stackup Layer buildup/stackup reference

4+6+4 HDI PCB stackup

In the layer structure of a PCB board, there are several important concepts.
PP (Prepreg): Prepreg is a semi-cured sheet, also known as prepreg material, a thin sheet material that impregnated with resin and cured to an intermediate degree. It is mainly used as the bonding material and insulation material for inner conductive patterns of multilayer printed circuit boards. After being laminated with Prepreg, the semi-cured epoxy resin is squeezed out, begins to flow, and solidifies, bonding the multilayer circuit boards together and forming a reliable insulating layer. In the PCB industry, Prepreg can be likened to glue, used to bond several cores together using the lamination method to create multilayer boards.
PP Type:1080(3.1mil), 3313(4.2mil), 2116(5.4mil), 7628(7.7mil).

Core: Core is a rigid material with specific thickness and copper on both sides.
The pressing materials for multilayer boards mainly consist of Prepreg and Core.

The differences between the two are:
- Prepreg is a material used in PCBs, with a semi-solid texture similar to cardboard, while core is a rigid material similar to copper.
- Prepreg functions as both an adhesive and insulator, whereas core serves as the foundational material for PCBs, with entirely different functional roles.
- Prepreg can be flexible, while core cannot be bent.
- Prepreg is non-conductive, whereas core has copper layers on both sides, serving as the conductive medium for the printed circuit board.

In other special cases or Advanced PCBs (you need to choose "Customized Services and Advanced Options" and Custom stackup or Impedance control):
1. If you need custom stackup or control impedance, we will manufacture according to your requirement.
2. After place order,we will calculate whether it meets the requirements based on the stackup , material and impedance information.Also we will confirm with you.

For flexible PCB stackup, please check "Stack-up for FPC".

For rigid PCB, in response to customer demand, PCBWay has added a variety of laminate structures to our products (currently, we have added 298 and will continue to update them), which can greatly satisfy product structural design and impedance requirements.

Capacités des PCB

Capacités des PCB
Capacités techniques du circuit imprimé Avancé
Structure stratifiée multicouche
Fabrication rapide des PCB
Prototypage des PCB
Production à faible volume
Processus de production
Produits de PCB
Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé
Rappels spéciaux
Exigences relatives aux fichiers
Foire aux questions sur l’assemblage des BPC
Processus de production
Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532
GaggiMate Controller

I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.

Ullrich

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

PCB standard stackup Total: 298
Layers
  • Please Select
  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Thickness (MM)
  • Please Select
  • 0.4MM
  • 0.6MM
  • 0.8MM
  • 1.0MM
  • 1.2MM
  • 1.6MM
  • 2.0MM
  • 2.4MM
Inner Copper (OZ)
  • Please Select
  • 0.5OZ
  • 1OZ
  • 1.5OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Outer Copper (OZ)
  • Please Select
  • 1OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Inner layer Residual copper ratio (%)
  • Please Select
  • 90%
  • 70%
  • 50%
  • 30%
Recherche
Réactualiser
Friendly Reminder: This is a through-hole board stack-up, not applicable for blind and buried vias. PCBWay supports customers to customize structures, and will continue to increase the structure diagrams.
4 Layers Total: 112
View all
1 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

SHOW MORE
6 Layers Total: 74
View all
1 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2250
PP 2116 RC58%
DK:4.45 		0.1300
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

SHOW MORE
8 Layers Total: 49
View all
1 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

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10 Layers Total: 33
View all
1 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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12 Layers Total: 12
View all
1 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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14 Layers Total: 6
View all
1 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.2085
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2085
PP 3313 RC58%
DK:4.45 		0.1030
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.97mm, tolerance: ±10%

Finished PCB Thickness: 2.07mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

16 Layers Total: 6
View all
1 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.39mm, tolerance: ±10%

Finished PCB Thickness: 2.49mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

18 Layers Total: 6
View all
1 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 0.5OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L2-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L4-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L10-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L12-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Front-end data preparation

01.ÉPI - Ingénierie de la pré-production

Les données fournies par le client (Gerber) sont utilisées pour produire les données de fabrication des circuits spécifiques (œuvres d’art pour les procédés d’imagerie et données de forage pour les programmes de forage). Les ingénieurs comparent les exigences et les spécifications aux capacités pour assurer la conformité et déterminer les étapes du processus et les vérifications. Aucun changement n’est autorisé sans la permission du groupe PCBWay.

Preparing

02.Board Cutting (Copper Clad Laminate Cutting)

PCB production starts with a large piece of sheet material. Due to the limitations of PCB production equipment and manufacture capabilities, the factory has requirements for its minimum and maximum processing size. Therefore, under the guidance of manufacture instruction (MI), the raw material of PCB (Copper Clad Laminate ) needs to be cut into the processing size by automatic cutting machine before production.

print icon

03.Imprimer les couches intérieures

L’étape 1 consiste à transférer l’image à l’aide d’une pellicule d’illustrations sur la surface du circuit, à l’aide de pellicule sèche photosensible et de lumière UV, ce qui polymérisera la pellicule. Cette étape du processus est effectuée dans une salle blanche. Imagerie – Processus de transfert de données électroniques vers le traceur de photos, qui utilise à son tour la lumière pour transférer un circuit d’image négatif sur le panneau ou le film.

etch icon

04.Graver les couches intérieures

L’étape 2 consiste à retirer le cuivre indésirable du panneau à l’aide de la gravure. Une fois que ce cuivre a été retiré, le film sec restant est ensuite retiré laissant derrière le circuit de cuivre correspondant à la conception.<br> Gravure – Élimination chimique ou chimique et électrolytique de parties indésirables de matières conductrices ou résistives

aoi icon

05.Inspection Automatique d’Optique des couches internes (AOI)

Inspection des circuits contre les « images » numériques pour vérifier que les circuits correspondent à la conception et qu’ils sont sans défauts. Les inspecteurs formés vérifieront toute anomalie soulignée par le processus de balayage. Le groupe PCBWay ne permet aucune réparation des circuits ouverts.

Lamination icon

06.Lay-up et lien (Laminage)

Les couches intérieures ont une couche d’oxyde appliquée puis « empilée » avec la pré-imprégné de résine assurant l’isolation entre les couches ; la feuille de cuivre est ajoutée au haut et au bas de la cheminée. Le procédé de laminage consiste à placer les couches internes sous une température extrême (375 degrés Fahrenheit) et une pression (275 à 400 lb/po2) tout en stratifiant avec une résistance photosensible à sec. Le circuit est autorisé à se durcir à une température élevée, la pression est libérée lentement, puis le matériau est refroidi lentement.

drilling icon

07.Forage du circuit imprimé

Nous devons maintenant percer les trous qui vont ensuite créer des connexions électriques dans le circuit imprimé multicouches. Il s’agit d’un processus de perçage mécanique qui doit être optimisé afin que nous puissions obtenir l’enregistrement à toutes les connexions de la couche intérieure. Les panneaux peuvent être empilés à ce processus. Le forage peut également être fait par une perceuse laser.

copper icon

08.Dépôt de cuivre

La première étape du processus de placage est le dépôt chimique d’une très mince couche de cuivre sur les parois du trou.
PTH fournit un dépôt très mince de cuivre qui couvre la paroi du trou et le circuit complet. Un procédé chimique complexe qui doit être strictement contrôlé pour permettre un dépôt fiable de cuivre à plaquer même sur la paroi de trou non métallique. Bien que la quantité de cuivre ne soit pas suffisante à elle seule, nous avons maintenant une continuité électrique entre les couches et à travers les trous. La combinaison est utilisée pour optimiser la quantité de cuivre à plaquer et à graver afin de répondre aux exigences.

image icon

09.Image des couches extérieures

Similaire au procédé de la couche interne (transfert d’image à l’aide d’une pellicule sèche photosensible, exposition à la lumière UV et gravure), mais avec une différence principale – nous enlèverons la pellicule sèche où nous voulons garder le cuivre / définir les circuits – afin que nous puissions tapisser du cuivre supplémentaire plus tard dans le processus.
Cette étape du processus est effectuée dans une salle blanche.

Plating icon

10.Placage

Deuxième étape de placage électrolytique, où le placage supplémentaire est déposé dans des zones sans film sec (circuitage). Une fois le cuivre plaqué, l’étain est appliqué pour protéger le cuivre plaqué.

etch icon

11.Couche extérieure gravée

Il s’agit normalement d’un processus en trois étapes. La première étape consiste à retirer la pellicule bleue sèche. La deuxième étape consiste à graver le cuivre exposé/indésirable tandis que le dépôt d’étain agit comme une gravure résistante pour la protection du cuivre dont nous avons besoin. La troisième et dernière étape consiste à retirer chimiquement le dépôt d’étain en quittant le circuit.

AOI

12.Inspection de la Couche extérieure

Tout comme avec la couche intérieure AOI, le panneau gravé et imagé est scanné pour s’assurer que le circuit répond à la conception et qu’il est sans défauts. Encore une fois, aucune réparation des circuits ouverts n’est autorisée en vertu des exigences de PCBWay.

Soldermask

13.Masque à souder

L’encre du masque à souder est appliquée sur toute la surface du circuit imprimé. À l’aide d’œuvres d’art et de lumière UV, nous exposons certaines zones aux rayons UV et les zones non exposées sont enlevées pendant le processus de développement chimique – généralement ce sont les zones qui doivent être utilisées comme surfaces soudables. Le masque Soldermask restant est ensuite entièrement durci, ce qui en fait une finition résiliente.<br> Cette étape du processus est effectuée dans une salle blanche.

Surface finish

14.Finition de surface

Différentes finitions sont ensuite appliquées sur les zones de cuivre exposées. Ceci permet de protéger la surface et une bonne soudabilité. Les différentes finitions peuvent inclure une Immersion nickel en or, Immersion en argent etc. Des tests épaisseurs et de soudabilité sont toujours effectuées.

Profile

15.Profil

Il s’agit du processus de coupe des panneaux de fabrication en tailles et formes spécifiques en fonction de la conception du client tel que défini dans les données Gerber. Trois options principales s’offrent à vous lorsque vous fournissez le tableau ou le panneau de vente – notation, acheminement ou poinçonnage. Toutes les dimensions sont mesurées par rapport au dessin fourni par le client pour s’assurer que le panneau est correct sur le plan dimensionnel.

Electrical test

16.Essai électrique

Utilisée pour vérifier l’intégrité des voies et des interconnexions traversant les trous – vérifiant qu’il n’y a pas de circuits ouverts ou de court-circuit sur la carte finie. Nous testons électriquement chaque PCB en fonction des données d’origine de la carte. À l’aide d’un testeur de sonde volant, nous vérifions chaque filet pour nous assurer qu’il est complet (pas de circuits ouverts) et ne court-circuite à aucun autre filet.

inspection

17.Inspection finale

Au cours de la dernière étape du processus, une équipe d’inspecteurs remet à chaque PCB une dernière vérification minutieuse, une vérification visuelle du PCB par rapport aux critères d’acceptation et l’utilisation d’inspecteurs « approuvés » de PCBWay. L’inspection visuelle manuelle et l’AVI permettent de comparer les PCB au Gerber et la vitesse de vérification est plus rapide que les yeux humains, mais il faut quand même une vérification humaine. Toutes les commandes sont également soumises à une inspection complète, y compris les dimensions, la soudabilité, etc.

Packaging

18.Emballage

Les panneaux sont enveloppés à l’aide de matériaux conformes aux exigences d’emballage de PCBWay (ESD etcetera) et ensuite emballés avant d’être expédié en utilisant le mode de transport demandé.

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