Mobile phone 3rd-order HDI board

Produits de PCB / HDI PCB / Mobile phone 3rd-order HDI board

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Applications

Smart phone

Features

Material

S1000-2M

Layers

12 Layers

Thickness

1.2±0.1mm

Min Hole Size

Laser hole 0.1mm

Min Track/Spacingh

65/65um

Minimum board thickness and hole ratio

Surface Finish

Immersion gold(ENIG)

Calculer

Détails du produit

The mobile phone's 3rd-order HDI PCB has a Min Track/Spacing of 65/65um and a minimum aperture of 0.1mm. This type of HDI circuit board is widely used in the field of smart phones.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

GaggiMate Controller

I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.

Ullrich

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

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