3rd-order HDI PCB buried resistor circuit board

Produits de PCB / HDI PCB / 3rd-order HDI PCB buried resistor circuit board

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Applications

Digital and automotive electronics

Features

Material

R5775G+IT180

Layers

8 Layers

Thickness

2.0±0.2mm

Min Hole Size

Laser blind hole 0.1mm, mechanical hole 0.2mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

10:1

Surface Finish

Immersion gold(ENIG) 0.05um

Calculer

Détails du produit

The 3rd-order HDI buried resistors circuit board is made of Panasonic R5775G + Lianmao IT180 high-speed materials, mixed pressure, buried resistors and surface immersion gold production processes. The products are widely used in mobile phones, cameras and other digital products and automotive electronics.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

GaggiMate Controller

I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.

Ullrich

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

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