PCB Prototype the Easy Way

Full feature custom PCB prototype service.

Exemple de circuits imprimés fabriqués par nous.

Nous avons les capacités de fabrication de PCB pour construire des planches simples à complexes. Veuillez passer en revue les circuits imprimés ci-dessous et nous faire savoir si vous avez des questions ou si vous souhaitez obtenir un devis officiel.

  • UAV PCB control main board

    10 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • UAV PCB ESC board

    12 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

  • 12-layer RF PCB

    12 layers, Material: RO4350B+TU-768, Thickness: 1.7±0.17mm

  • 5G RF PCB

    4 layers, Material: RO4350B+TU768, Thickness: 1.6mm

  • Industrial control software and hardware combination PCB

    14 layers, Material: DuPont+S1000-2M, Thickness: 2.0±0.2mm

  • High-density aerospace PCB

    24 layers, Material: RO4350B+TU-768, Thickness: 3.2±0.32mm

  • 5G optical module PCB

    8 layers, Material: IT968TC, Thickness: 1.0±0.1mm

  • 4G optical module PCB

    10 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • High-speed computer golden finger card board

    14 layers, Material: IT170GRA1TC, Thickness: 1.6±0.05mm

  • Ultra-high speed PCB gold finger board

    16 layers, Material: TU-872SLK+RO4350b, Thickness: 1.8±0.1mm

  • 400G high frequency PCB

    10 layers, Material: IT968TC+S1000-2M, Thickness: 1.0±0.1mm

  • 5G high frequency PCB

    4 layers, Material: RO4350B+TU768, Thickness: 1.6±0.16mm

  • 24-layer high-density high-speed PCB

    24 layers, Material: TU872SLK, Thickness: 3.2±0.32mm

  • 24-layer high-density aerospace PCB

    24 layers, Material: TU872SLK, Thickness: 3.2±0.32mm

  • 20-layer server backplane PCB

    20 layers, Material: TU-872, Thickness: 5.0±0.5mm

  • 16-layer thick-gold PCB

    16 layers, Material: S1000-2M, Thickness: 6.5mm±0.3mm

  • 16-layer ultra-fine pitch PCB

    16 layers, Material: S1000-2M, Thickness: 2.5±0.25mm

  • 14-layer high-thickness-to-diameter ratio semiconductor test thick gold PCB

    14 layers, Material: S1000-2M, Thickness: 5.0mm±0.5mm

  • 3rd-order 18-layer buried/blind via PCB

    18 layers, Material: S1000-2M, Thickness: 2.1±0.21mm

  • Thick gold semiconductor test PCB

    16 layers, Material: S1000-2M, Thickness: 6.5mm±0.3mm

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