3rd-order 18-layer buried/blind via PCB

Produits de PCB / High-level PCB / 3rd-order 18-layer buried/blind via PCB

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Applications

Chip testing field

Features

3 times laser drilling, 4 times pressing

Material

S1000-2M

Layers

18 Layers

Thickness

2.1±0.21mm

Min Hole Size

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

11:1

Surface Finish

Calculer

Détails du produit

3rd-order 18-layer buried/blind via PCB, mainly used in the field of chip testing.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

GaggiMate Controller

I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.

Ullrich

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

Nos capabilités: Capacités des PCB; Service d’assemblage des Cartes de circuits; Fabrication rapide des PCB; Pochoirs CMS; Prototype de Cartes de circuit; Contrôle de la qualité

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Exemple de circuits imprimés fabriqués par nous.