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Exemple de circuits imprimés fabriqués par nous.

Nous avons les capacités de fabrication de PCB pour construire des planches simples à complexes. Veuillez passer en revue les circuits imprimés ci-dessous et nous faire savoir si vous avez des questions ou si vous souhaitez obtenir un devis officiel.

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5G mobile phone PCB motherboard

Applications
5G mobile phone
Features
/
Material
S1000-2M
Layers
12 Layers
Thickness
1.2±0.1mm
Min Hole Size
/
Min Track/Spacingh
65/65um
Minimum board thickness and hole ratio
/
Surface Finish
Immersion gold(ENIG)+OSP
Calculer
Détails du produit

The 5G mobile phone PCB motherboard is made of Shengyi S1000-2M material through surface immersion gold, laser drilling and OSP processes. This type of HDI circuit board is widely used in the field of smart phones.

5g-1-1.jpeg

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+86-571-85317532

Ahmed

Kowalski