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Design requirements for half-holes (Requirements apply to the copper layer, solder mask layer, and drilling layer)
1. The copper layer should retain pads, and the solder mask layer should have openings.
2. Plated through holes that extend beyond the board edge are considered half-holes, with vias being exempted.
3. The diameter of half-holes should be greater than 0.4 mm, and the spacing between holes should be greater than 0.4 mm.
For other correct design examples, please refer to the figure below.