Flexible PCBs - PCBWay

Flex PCBs in The Future Trend

As technology continues to advance and demand for more compact, lightweight, and innovative electronic devices grows, flex PCBs are expected to play an increasingly important role in the future. The unique characteristics of flex PCBs, including their adaptability, durability, and design versatility, make them well-suited for emerging trends and applications.

What are Advantages of Flexible PCB?

Excellent flexibility

The flexibility of flex PCBs is one of their key characteristics and advantages over traditional rigid PCBs. This unique attribute is achieved through the use of flexible materials, such as polyimide or polyester films, as the base substrate for the circuitry. The flexible nature of these materials allows flex PCBs to bend, fold, and twist without causing damage to the circuits or impacting their functionality.

Space and weight savings

Flex PCBs are thin and lightweight, allowing for compact designs that save space and reduce the overall weight of electronic devices, which is particularly important for aerospace, automotive, and wearable applications.

Durability

The flexible nature of flex PCBs makes them more resistant to shock, vibration, and mechanical stress, resulting in improved reliability and longer product life.

Improved heat dissipation

The thin and flexible materials used in flex PCBs offer better heat dissipation compared to traditional rigid PCBs, which can help maintain optimal performance and extend the life of electronic components.

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Comparison between Polyethylene Terephthalate (PET) and Polyimide (PI)

PCBWay adheres to the highest quality standards in material selection

Type	Polyester(PET)	Adhesive Polymide	Adhesiveless Polymide
Flexibility (2mm radius)	Bad	Good	Best
Tear strength	800g	500g	500g
Strip strength in the air	1050N/M	1750N/M	1225N/M
Eatching>=20%	BEST	Bad	Good
Working temperature	80	85~165	105~200
Chip	Bad	Good	Best

Common Characteristics of Flexible PCBs

Single-Layer Flexible PCBs

Double-Layer Flexible PCBs

Multilayer Flexible PCBs

Characteristics

1- Consist of one conductive layer, typically copper, laminated to a flexible substrate.
2- Easier to design and manufacture due to their simplicity.
3- Lower production costs compared to double-layer and multilayer flex PCBs.
4- Lightweight and compact design.
5- Ideal for low-complexity circuits and simple applications.
6- Commonly used in sensors, switches, connectors, and wearable devices.

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Characteristics

1- Comprise two conductive layers, separated by an insulating layer, and laminated to a flexible substrate.
2- Increased design complexity compared to single-layer flex PCBs.
3- Enable more complex circuitry and higher component density.
4- Require vias or plated through-holes for interconnection between layers.
5- Suitable for moderate-complexity applications with space constraints.
6- Commonly used in consumer electronics, medical devices, and automotive systems.

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Characteristics

1- Consist of three or more conductive layers, separated by insulating layers, and laminated to a flexible substrate.
2- Complex design and manufacturing process compared to single-layer and double-layer flex PCBs.
3- Support high-density circuits and advanced electronic applications.
4- Require vias, blind vias, or buried vias for interconnection between layers.
5- Increased signal integrity and reduced electromagnetic interference due to internal signal layers and ground planes.
6- Suitable for high-complexity applications with stringent performance requirements.
7- Commonly used in aerospace, defense, telecommunications, and advanced medical devices.

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Ability in Process Technology

Feature	Capability
Layer	1-12
Board thickness (without stiffener)	4‐40 mil
Tolerance of single layer	±1.0mil
Tolerance of double‐layer (≤12mil)	±1.2 mil
Tolerance of multi‐layer (≤12mil)	±1.2 mil
Tolerance of multi‐layer (12mil‐32mil)	±8%
Tolerance of board thickness (including PI stiffener)	±10%
Min. board size	0.0788” 0.1576” (without bridge) 0.3152” 0.3152” (with bridge)
Max. board size	8.668” * 27.5”
Impedance control tolerance	±4Ω (≤50Ω), ±7% (>50Ω)
Min. coverlay bridge	8 mil

Feature	Capability
Min. bend radius of single layer	3‐6 times of board thickness
Min. bend radius of double‐layer	7‐10 times of board thickness
Min. bend radius of multi‐layer	10‐15 times of board thickness
Min. mechanical drill hole	4 mil
Inner Layer Trace/ Space	2/ 2 mil
Outer Layer Trace/ Space	2/ 2 mil
Solder mask color	Green\Black
Surface treatment	HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold, Immersion silver and OSP, Immersion tin
Laser accuracy (Routing)	±2 mil
Punching accuracy (Routing)	±2 mil ‐ ±6 mil

Material：	PI, FR-4
Layers：	12
Thickness：	1.6mm
Min Hole Size:	0.25mm
Min Track/Spacing：	3/3mil

Layers：	2
Thickness：	0.1mm
Min Hole Size：	0.2mm
Min Track/Spacing：	3/3mil
Surface Finish：	Immersion gold(ENIG)

Material：	PI, FR-4
Layers：	7
Thickness：	0.45mm
Min Hole Size：	0.3mm
Min Track/Spacing：	4/4mil

Material：	PI, FR-4
Layers：	4
Thickness：	1.6mm
Min Hole Size：	0.75mm

Material：	PI, FR-4
Layers：	10
Thickness：	2.0mm
Min Hole Size：	0.25mm
Board thickness and via diameter ratio：	8:1

Material：	PI
Layers：	4
Thickness：	0.2mm
Min Hole Size：	0.15mm
Min Track/Spacing：	2.2/2.2mil

Material：	PI
Layers：	4
Thickness：	0.8mm
Min Hole Size：	0.15mm
Min Track/Spacing：	2.5/2.5mil

Manufacturing Production Capacity

Upgrading of copper deposition line

Improve the process capability of PTH sunk copper (especially blind holes) to provide customers with high reliability products.

VCP copper plating line

Enhance copper plating capacity, improve copper plating uniformity, and have HDI hole filling capability.

4-wire flying probe tester

Better discriminate the product micro open circuit, micro short circuit, provide high precision resistance test requirements, make the product more reliable.

LDI laser direct imaging exposure machine

Achieves higher resolution while balancing the need for high alignment accuracy and high throughput.

Vacuum press

Enhance the effect of laminating rigid-flex PCBs and multilayer PCBs.

Laser equipment

Improve sample response speed as well as cover film,contour processing accuracy, with HDI laser drilling capability.

PCBWay's Advantages

PCBWay offers a wide range of PCB services, including flex, rigid-flex, and rigid PCB fabrication, ensuring that we can cater to diverse project requirements. We use top-grade materials and state-of-the-art equipment to guarantee optimal performance and reliability of their PCBs. PCBWay's commitment to quality, affordability, and customer satisfaction makes us a top choice for businesses and individuals seeking high-quality, customized, and reliable PCB fabrication services.

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Testing and Inspection Equipment

Salt spray tester

X-ray surface treatment thickness gauge

Metallographic section microscope

AOI inspection machine

Ion contamination tester

2D dimensional measuring instrument

Impedance tester

RoHS/HF tester

FAQ's

Flexible VS Rigid-Flex PCBs

Flexible materials low weight, high insulation capacity, and stability under extreme temperatures and, not least, the ability to let the circuit to be bent must be the big advantage over rigid PCBs.

The rigid PCBs easier production and much lower material cost are crucial, what make rigid PCBs the first choice.

High Temperature and High-Density Applications?

In many cases, flex circuits are made of polyimide or a similar polymer. This material dissipates heat better than most rigid circuit board materials. For this reason, flexible circuits can be placed in inconvenient locations where heat would impact the performance of a rigid circuit board.

Rigid-Flex PCBs Technology and Production Process?

Whether producing a rigid flex prototype or production quantities requiring large scale Rigid-Flex PCBs fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of Rigid-Flex solutions and a proper assessment of the available options at the early stages in the rigid-flex PCB design phase will return significant benefits. The Rigid-Flex PCBs fabricator must be involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The Rigid-Flex manufacturing phase is also more complex and time-consuming than rigid board fabrication. All the flexible components of the Rigid-Flex assembly have completely different handling, etching, and soldering processes than rigid FR4 boards.

Flexible Circuit Boards Can be Designed to Withstand Extreme Temperatures?

Between -200° C and 400° C - which explains why they are so suitable for borehole measurements in the oil and gas industry.

High temperature resistance is usually accompanied by good chemical resistance and excellent resistance to radiation and ultraviolet radiation. Combined with the ability to control impedance in high density board designs, flexible circuit designs offer many benefits to manufacturers.

What are Flexible PCBs Used for?

The major reason for designing PCB in flexible material are the bending ability of the circuit. Eigther as a fixed bent mounting or as dynamic flexing design. Low weight and excellent possibility for miniaturization.

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Flex PCBs in The Future Trend

What are Advantages of Flexible PCB?

Excellent flexibility

Space and weight savings

Durability

Improved heat dissipation

Comparison between Polyethylene Terephthalate (PET) and Polyimide (PI)

PCBWay adheres to the highest quality standards in material selection

Common Characteristics of Flexible PCBs

Characteristics

Characteristics

Characteristics

Ability in Process Technology

Featured Product Solutions

Manufacturing Production Capacity

PCBWay's Advantages

Testing and Inspection Equipment

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FAQ's

Flexible VS Rigid-Flex PCBs

High Temperature and High-Density Applications?

Rigid-Flex PCBs Technology and Production Process?

Flexible Circuit Boards Can be Designed to Withstand Extreme Temperatures?

What are Flexible PCBs Used for?

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